Synthetic Suspension Lapping Vehicle
AQUALAP 200 is an advanced generation suspension lapping gel created especially for the lapping of silicon wafers. AQUALAP 200 is compatible with abrasives commonly used for silicon wafer lapping, including Fujimi FO powder and PWA.
Product Benefits / Features:
- Improves total thickness variation
- Very high suspension, even at economical usage levels as low as 4.5-5%
- Non-staining and easy to clean
- Reduced abrasive consumption
- Reduced scratch rates
- Effective with a wide range of abrasives
Typical Properties:
| Appearance: | TRANSPERENT Gel |
|---|---|
| Density - (G/CC): | 1.02 – 1.04 |
| pH: | 9.00 - 9.50 |
| RoHs compliant |
*Typical Properties do not constitute exact specifications.
Application:
STARTING SLURRY FORMULA BY WEIGHT:
| AQUALAP 200 | 3.5 – 5% |
|---|---|
| Fujimi PWA, or FO powder | 15-25% |
| Deionized Water | Balance to 100% |
*Note: If using abrasives other than Fujimi, we recommend that the customer sends samples to our laboratory for compatibility testing.
Mixing:
Slurry preparation: homogeneous slurry preparation is critical to achieve the best wafer quality.
Please refer to PRP’s technical data sheet describing how to achieve homogeneous slurry on a repeatable basis.
Cleaning:
Process Research Products recommends the use of Ultraclean 1435 A or Ultraclean EU for post lap cleaning. Our Technical Service Department would be happy to discuss alternate cleaners for special applications.
