The Aqualap range of synthetic lapping vehicles are the gold standard for the lapping of semiconductor wafers. Aqualap lapping gels are used in the lapping of many types of wafers including silicon, sapphire, and silicon carbide. Aqualap products are always mixed into slurries with deionized water and precision abrasives such as calcined alumina, diamond powder, or Fujimi FO. When used as recommended it is possible to produce uniform slurry viscosity on a repeatable basis. Aqualap slurry stability is critical in the production of scratch-free wafers. For best results please refer to the mixing instructions and the product data sheets.
Oil-Based Wire Saw Fluids
Process Research Products has successfully developed a range of oil-based wire saw fluids for slicing silicon and silicon carbide and other semiconductor materials. All products have excellent suspension properties. Silcut products are recommended for use on Meyer Burger, NTC and Takatori machines.
For diamond wire slicing, Silcut synthetic glycol fluids coolants are recommended.
Silcool synthetic high dilution grinding coolants were originally developed for I.D. sawing of silicon.
Typically, Silcool is now used in grinding operations with fixed diamond abrasive such as boule grinding and edge grinding. The dilution ratio is 1 to 400 in deionized water. Silcool products have very low surface tension and excellent wetting characteristics, and exhibit strong corrosion protection capability.
The Ultraclean range of water-based cleaners are available from neutral pH to very high pH for the cleaning of both semiconductor and ceramic wafers. Ultraclean products all have high reserve alkalinity and give long tank life. In some instances, tank life can be extended by the addition of caustic. Ultraclean KOH (potassium hydroxide) is especially designed for use in ultrasonic cleaning baths. Other Ultraclean products can be used in spray applications. Please refer to the product data sheets for further information.