Oil-Based Wire Saw Fluids
PROCESS RESEARCH PRODUCTS successfully developed a series of oil-based wire saw slicing fluids for slicing silicon carbide, quartz, sapphire, lithium tantalate, and other electronic semiconductor materials. All products have been designed with excellent suspension properties for silicon carbide, B4C, and diamond abrasives typically used in these applications.
When mixed with diamond abrasive, the Silcut series creates an excellent slurry for the slicing of SiC wafers, with proven success on 2” through 8” ingots.
Product Benefits / Features:
- Excellent suspension and dispersion stability
- Minimal viscosity increase during use
- Temperature stable viscosity
- Recyclable
Typical Properties:
| Appearance: | Silcut RT: Opaque Liquid, Silcut S-LV: Opaque Liquid |
|---|---|
| Odor: | Silcut RT: Bland, Silcut S-LV: Bland |
| Viscosity: | Silcut RT: low, Silcut S-LV: ultra low |
| Clean Up | Silcut RT: hot water, Silcut S-LV: solvent |
| RoHs compliant |
*Typical Properties do not constitute exact specifications.
Application:
Prepare slurry by adding up to 1 kg abrasive (diamond | B4C| silicon carbide) to 1-liter SILCUT RT and mixing until homogeneous. Silcut S-LV is used as a diluent to reduce viscosity as swarf from the cutting operation builds into the slurry.
Cleaning:
All cleaning is improved by using ultrasonic baths. We recommend UltraClean 04K at 40KHZ – 58KHZ.
