Silicon Carbide (SiC)
Silicon carbide (SiC) semiconductor substrate materials, after diamonds, are the hardest material on earth. From the growth of the boule to the chip production, there are many steps that require cutting, grinding, lapping, polishing, and cleaning. These production steps take considerable time.
Process Research Products have formulated, refined, and manufactured the following products for the SiC Industry over many years. These products have been developed in our own in-house R&D laboratory on Takatori wire saws and Hamai lapping machines and using Crest ultrasonic cleaning baths.
Slurry sawing
Silcut RT and Silcut SLV low viscosity suspension oil
Grinding
R-30 synthetic grinding coolant
Ultrasonic cleaning
Ultraclean 04K
Diamond wire sawing
Procut synthetic coolant
Double sided lapping / stock polish
DS-3 a slurry made from Aqualap TTV synthetic gel with DI water and Diamond Powder
