Advanced Lapping Vehicle for Silicon, SiC, and Sapphire Wafers
Product Benefits / Features:
- 50% reduction in flow rates compared to competitive products
- Improved total thickness variation
- Very high suspension capability
- Rapid stock removal
- Excellent lubrication properties; reduces scratches
- Environmentally friendly - reduces lapping waste
- Designed for wafers up to 300mm
Typical Properties:
| Appearance: | Clear Gel |
|---|---|
| Density - (G/CC): | 1.00 – 1.03 |
| pH: | 8.80 – 9.30 |
| RoHs compliant |
*Typical Properties do not constitute exact specifications.
Application:
STARTING SLURRY FORMULA BY WEIGHT:
| AQUALAP TTV | 4% |
|---|---|
| FUJIMI PWA or FO ABRASIVE | 20% |
| Deionized Water | 76% |
Mixing:
Slurry preparation: homogeneous slurry preparation is critical to achieve the best wafer quality.
Please refer to PRP’s technical data sheet describing how to achieve homogeneous slurry on a repeatable basis.
Cleaning:
Process Research Products recommends the use of Ultraclean 1435 A or Ultraclean EU for post lap cleaning. Our Technical Service Department would be happy to discuss alternate cleaners for special applications
