Oil-Based Wire Saw Fluids
PROCESS RESEARCH PRODUCTS successfully developed a series of oil-based wire saw slicing fluids for slicing silicon carbide, quartz, sapphire, lithium tantalate, and other electronic semiconductor materials. All products have been designed with excellent suspension properties for silicon carbide, B4C, and diamond abrasives typically used in these applications.
When mixed with diamond abrasive, the Silcut series creates an excellent slurry for the slicing of SiC wafers, with proven success on 2” through 8” ingots.
