Full Suspension Water-Based Diamond Slurry Lapping and Polishing
DS-3 is a ready-for-use slurry based on Aqualap-TTV technology. It contains 3-micron diamond abrasive for use in double sided lapping and polishing of silicon carbide wafers.
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DS-3 is a ready-for-use slurry based on Aqualap-TTV technology. It contains 3-micron diamond abrasive for use in double sided lapping and polishing of silicon carbide wafers.
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R30 is a fully synthetic, water-soluble coolant for use in grinding, lapping, and shaping operations on both ferrous and non-ferrous metals, including SiC and ceramics. R30 exhibits minimal foam and excellent biological resistance, making it ideal for central systems.
R30 offers superb cleaning and wetting characteristics; tool life is increased and surface finish improved. Rapid settling of swarf from coolant aids filtration and extends coolant life; it also allows increased feed rates while maintaining surface finish and reduced cracking on thin and difficult-to-grind substrates.
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PROCUT 50 is a highly concentrated, water soluble, non-foaming, dye-free coolant used with diamond-coated wire for wafering. PROCUT 50 is a versatile product that works well on hard substrates including sapphire and poly/mono crystalline silicon. PROCUT 50’s unique formulation keeps the diamond wire free from swarf buildup, improving cut rate and wire life. PROCUT 50 improves machine cleanliness.
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PROCESS RESEARCH PRODUCTS successfully developed a series of oil-based wire saw slicing fluids for slicing silicon carbide, quartz, sapphire, lithium tantalate, and other electronic semiconductor materials. All products have been designed with excellent suspension properties for silicon carbide, B4C, and diamond abrasives typically used in these applications.
When mixed with diamond abrasive, the Silcut series creates an excellent slurry for the slicing of SiC wafers, with proven success on 2” through 8” ingots.
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ULTRACLEAN 04-K is a high pH KOH (potassium hydroxide)-based highly alkaline cleaner, formulated for the removal of wire saw slurries and lapping slurries from solar and semiconductor wafers. ULTRACLEAN 04‑K is designed for use in ultrasonic tanks.
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RP-TEAM is a liquid, mildly alkaline organic rust preventative designed for direct application to lapping plates or similar surfaces. The product is recommended to be used undiluted, but is water-soluble. RP-TEAM may also be added to most aqueous lapping vehicles to increase rust protection properties. RP-TEAM finds wide application in silicon wafer lapping operations. It is effective in the prevention of the inevitable dark grid lines that sometimes form in wafers in the lapping process due to the elements of iron and carbon present in cast iron lapping plates.
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